RUSALOX LLC is a progressive nanotech developer and manufacturer of high thermal conductivity substrates and solutions for semiconductror, power, high-frequency, microelectronics and aerospace industries. RUSALOX LLC was established in December 2010 when two major state-owned investment funds have joined forces to develop and implement promising high thermal conductivity PCB nanotechnology in mass production. The technology is based on the innovative concept of nano-porous material layers constructing multilevel switching combining aluminum and aluminum oxide in their structure. Aloxide technology has a number of unique advantages that enables it to compete easily with the traditional solutions: 1) efficient thermal conductivity of five times better than the standard solutions existing on the market; 2) no gluing and drilling operations; 3) eco-friendliness as all the waste is being recycled; 4) cost efficiency as RUSALOX’s solutions are energy-saving; and 5) price efficiency. RUSALOX gains the price advantage by reducing the size of aluminum heatsink and BOM.
Highest reliability is one of the most important and key attributes of aloxide technology and products. Aloxide-based products, substrates and packages demonstrate the highest reliability standards required in the semiconductor electronics packaging. Rusalox’s aloxide PCBs successfully passed extensive reliability tests according to the most stringent requirements commonly used in the industry.