26 Sep 2018
Aluminum Oxide PCB – Technology for Developing New Generation LED Solutions
The LED industry is developing and posing new challenges to manufacturers of LEDs, PCBs, thermal interfaces and cooling systems. In particular, PCB manufacturers for LED applications solve conflicting tasks:
1. dielectric thermal resistance reduction – increase of the breakdown voltages;
2. placement of LEDs, current supply and control circuit in a single module with limited area – ensuring a uniform luminous flux and using standard lenses.
In fact, these points send developers to the laminate material (substrate) that combines the advantages of ceramics in terms of thermal management and high electrical strength, and FR4, which provides the flexibility of transition between layers at low price.
RUSALOX is systematically conducting R&D works and seeking for new engineering solutions based on al oxide material. In 2017 a major R&D project was launched and for the first quarter of 2018 highly qualified, al oxide production experienced team has achieved the following results in serial production:
1 high thermal conductivity of the dielectric of 12-24 W/mK depending on dielectric thickness;
2 breakdown voltages up to 7000 V DC;
3 double-sided PCBs with PTH with diameter from 0,4 mm
These results enable to design high-power LED modules with high-densed of LEDs (so called “High Power LED on Board” – hereinafter “LOB”) and with current supply elements (“Driver on Board” – hereinafter DOB) placed on the PCB reverse side in areas not adjacent to a heat sink. Such solutions are analogues of Chip-on-Board LEDs – AC Version (hereinafter “COB AC”). High breakdown voltages of 5-7 kV enable al oxide PCBs to be used in the most demanding applications where dielectric strength and thermal management are critical. These solutions are a response to customer requests, not only in terms of technical requirements, but also pricing policy, and are keeping pace with the LED market trends.