Rapid Evolution of High-Power LEDs Package from SMD to CSP to Direct Mountable Chip

LpS 2018 - LEDs, OLEDs & Laser Light Sources
26 Sep 2018
11:30-12:00
Seestudio

Rapid Evolution of High-Power LEDs Package from SMD to CSP to Direct Mountable Chip

In recent years, Chip-Scale Package (CSP) have been introduced to certain lighting applications. Compared to conventional Surface-Mount Device (SMD) high-power LEDs, the CSP technology has improved on compact design and thermal management. Nowadays, the adoption of Direct Mountable Chip has increased to ensure reliability and optimum performance of LED lighting fixtures. In this paper, we first explain how the Direct Mountable Chip technology is providing similar advantages as CSP, over SMD package. We also discuss the benefits of the new solution to overcome CSP limitations at module level by reducing crosstalk to improve optical emission and color shift. Then, we give an outlook of the Direct Mountable Chip integration in wider lighting applications by maximizing flux density and introducing color LEDs.