Boulay, Pierrick

Yole Développement, Market and Technology Analyst

Boulay, Pierrick

Yole Développement, Market and Technology Analyst

Biography

Pierrick Boulay works as Market and Technology Analyst in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis at Yole Développement, the “More than Moore” market research and strategy consulting company. He has experience in both LED lighting (general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting applications. Pierrick holds a master degree in Electronics (ESEO – France).


Chip Scale Package LED Lighting Modules: Opportunities and Challenges

Growth of the LED industry initially came from small display applications and was driven forward by larger LCDs. Since 2012, most companies have been participating in the ultimate application for the LED business, general lighting. Now, for Solid State Lighting (SSL) to grow, the industry expects strong price decreases through development of new LED platforms.

Standard LED lighting modules represent the main answer to SSL industry needs. Such modules are a basic ‘plug and play’ component of the lighting system that allow new luminaires to be easily and rapidly introduced to the market. These modules significantly contribute to system performance, quality and safety. Many LED lighting modules are currently available, including mid-power and high-power modules. Mid-power LED modules offer low power consumption and high flux whereas high-power LED modules deliver more flux and offer a larger Light Emitting Surface (LES). Chip-on-board (COB) LED modules provide a compromise between size of light, LES, flux power and power consumption.
In this field, a new type of module has emerged: Chip Scale Package (CSP) LED module. These modules are based on CSP LED device that provides several advantages, such as: Miniaturized size, potential lower manufacturing cost, better thermal contact to substrates through “Metal / Metal” interface of the bottom epilayer to the PCB or to the heat sink (…). However integration of such devices into modules highlights several challenges also. Indeed, main functions / components of the module (optics, thermal management and drivers) have to be redesigned to fully benefits from CSP Devices’ added value.

Also, it is important to understand performance in applications of such module, and define clearly the position of such module. Is a CSP LED lighting module a cost effective High Power LED module or a super Middle Power LED module? Indeed, CSP LED modules present opportunities in specific applications.
In this presentation, we will present an overview of CSP LED module (including device aspects), and highlight main benefits and challenges for the technology to find opportunities in the Solid State Lighting market.

All session by Boulay, Pierrick

Session 2 – DAY 1 | SEPT 26

13:00 - 14:30
SEESTUDIO, SEEFOYER, PROPTER HOMINES
LED professional Symposium +Expo
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